A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.

Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.

April 16, 2013 - Hermes Testing Solution Inc. and Invensas Corporation Enter Into Long-term Technology and Patent Licensing Agreement

Press Release in Traditional Chinese