MOBILE: ULTRA-HIGH I/O WITHOUT TSV
ZiBond® & DBI®:Wafer Bonding and Interconnect for 2.5D/3DIC, Sensor
A global leader in semiconductor interconnect solutions, Invensas invents, productizes and acquires novel technology to provide broader and more complete solutions for our customers.
Invensas’ design capabilities extend from chip-level to board module and system-level. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D integrated circuit (3D-IC) technologies.
December 2, 2015 -
Invensas Licenses BVA® Vertical Interconnect Technology to Tong Hsing for MEMS Applications
October 29, 2015 -
Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions
Multi-die face-down (xFD®) high-performance stacked DRAM
Bond Via Array (BVA®) Package-on-Package: Enabling technology for advanced mobile applications
May 31-June 3, 2016
The Cosmopolitan of Las Vegas,
Las Vegas, NV, USA
More events coming soon.